March 9, 2020
Synopsis : Book Lovers by Emily Henry.epub.
On the strength of promises, they are about to make a deal with the college bad boy.The present invention relates generally to a system and method for protecting wafer fabrication equipment, and more particularly, to a system and method for protecting wafer fabrication equipment from electrostatic discharge (ESD).
In the semiconductor industry, wafers (e.g., silicon wafers) are used to manufacture integrated circuits and are usually processed in chambers and production lines. In a wafer fabrication process, a wafer is loaded into a cassette and placed into a tool such as a film deposition chamber, an etching chamber, or a cleaning chamber. A vacuum pump provides a vacuum condition in the tool to facilitate the processing of the wafer. Wafers are generally manufactured from silicon and are generally circular with diameters of approximately 300 mm. When the wafer is not in the chamber, the wafer is generally placed into a cassette by a robot. During processing in the chamber, an electrical potential difference between the wafer and the chamber may cause arcing and generate static electricity. The static electricity on the wafer can damage the circuitry in the wafer and lead to wafer defects and produce particles. When the wafer is placed into the chamber, the wafer can be damaged by the ESD during a vacuum pump evacuation of the chamber and before the vacuum pump is powered on.
It is very difficult to prevent ESD damage from occurring when a wafer is loaded into a chamber. Further, for a production line, a process chamber is typically changed every three to four hours. The time it takes to change the process chamber increases the ESD damage time in the new chamber. For example, a robot typically places a wafer into a cassette using a vacuum robot. The wafer is placed into the cassette in an ESD-prone state. Further, the ESD caused by the wafer movement and the discharge to the chamber and vacuum pump may add up to a substantial amount of damage.
Additionally, the ESD protective system has not been adequately designed and configured to perform effectively. In the current system, high-energy particles (e.g., heavy particles such as particles that have a higher kinetic energy than typical particles, etc.) are captured using a high energy detector and the high energy particles are subjected to various algorithms to determine the magnitude of the charge. This method may cause damage to the process chamber be359ba680
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